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3 mm

Description

SV Microwave just launched our line of 3mm coaxial between board spacing PCB interconnects. This line allows for the lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system. SV’s 3mm product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.

C/A Instructions Request
(if applicable)

 

*Technical specifications are generic to the product series and are not part number specific.
 
Electrical  
Frequency DC - 40 GHz
Impedance 50Ω
VSWR Stripline

DC to 18 GHz

DC to 40 GHz

1.10 : 1

1.30 : 1

VSWR Stripline

DC to 18 GHz

DC to 40 GHz

.30 dB

.60 dB

Mechanical  
Board-to-Board Spacing .1134" Min, .1184" Max
Engage Force into SB / Disengage Force from SB 2.8 lbs typ / 2.5 lbs typ
Engage Force into FD / Disengage Force from FD 3.4 lbs typ / 3.0 lbs typ
Axial Misalignment .005"
Radial Misalignment .007"
Mating Cycles (min) 500
Temperature Range -65 to +165°C

 

Applications:
  • High density stacked PCB applications
  • Embedded computing
  • High density multiport applications
Features and Benefits:
  • 3mm board-to-board spacing
  • 150" minimum pitch between adjacent connectors
  • DC - 40 GHz
  • Low-force, solderless installation does not damage PCB
  • Easy to assemble, solderless design reduces yield and assembly time
  • Lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system